Just accepted manuscript in ACS Applied Materials & Interfaces

thin-carbon-films-102016The paper “Electrochemically active thin carbon films with enhanced adhesion to silicon substrates” (Pengfei Niu, Laura Asturias-Arribas, Martí Gich, César Fernández-Sánchez, and Anna Roig) has been published online as a Just Accepted Manuscript in ACS Applied Materials & Interfaces (DOI: 10.1021/acsami.6b07347). 

Abstract:

Thin carbon films deposited on technologically relevant substrates, such as silicon wafers, can be easily implemented in miniaturized electrochemical devices and used for sensing applications. However, a major issue in most carbon films is the weak film/substrate adhesion that shortens the working device lifetime. This paper describes the facile preparation of robust thin carbon films on silicon/silicon oxide substrates by one-pot sol-gel synthesis. The improved adherence of these carbon films is based on the incorporation of silica through the controlled synthesis of a resorcinol/formaldehyde gel modified with aminopropyltriethoxysilane. The films demonstrate excellent adhesion to the silicon/silicon oxide substrate, good homogeneity, excellent electrical conductivity and superior electrochemical performance. Moreover, this approach opens the door to the fabrication of thin carbon film electrodes by photolithographic techniques.

Congratulations!

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